NAMICS is the world’s leading supplier of capillary underfills for packaging level applications. Underfills are an insulating material designed to flow under flip chip devices to reinforce bumps and mounting board.

NAMICS H9890 series is a pressure-less, low-temperature sintering silver paste combined with resin reinforcement and low-modulus technology.

NAMICS is the world’s leading supplier of underfills for a diverse number of applications. The current trend for CSPs and BGAs are moving towards finer pitch designs due to increase in I/O (input and output) count causing solder joints to decrease in size.