Camera Module Adhesives

Dual cure adhesive for precision camera alignment

• Fixed-focus and Auto-focus camera modules
• Flexible cure options to LCP and PC
• Natural light blocking (less than 1% visible light range)
• Fine line printing

Adhesive for securing lens barrel to frame

• High adhesion strength for thermoplastics like polycarbonate (PC)
  and liquid crystalline polymers (LCP)
• Offers low temperature cure to reduce stress
• Excellent moisture resistance

Low stress adhesive for bonding IR Filter to substrate

• High adhesion strength to variety of materials such as PC and
  LCP
• Dual cure option; UV and thermal cure
  • Low temperature cure (80°C)
  • High depth of UV cure

Low stress encapsulant for wirebond protection

• Excellent moisture protection
• Outstanding workability
  • High thixotropic index (TI) to minimize flow

Low stress adhesive for filling gap between

• Low viscosity for high flow into narrow gap
• Low temperature cure (80°C) to minimize stress
• Controlled modulus for high reliability

Non-conductive

adhesive for grounding and conductive for connecting bottom stiffener to camera module

• Non-conductive adhesive
  • High reliability –> Excellent moisture
    resistance
  • Reduce stress –> Low temperature curing
• Conductive adhesive
  • High reliability –> Excellent moisture resistance
  • High volume production capable
    • High jet dispensability
    • Low temperature curing capable (>100°C)

Designed to
support during environmental & shock / vibration testing

• Excellent flow thru narrow gap
  • High UPH (units per hour)
  • Capable of controlling flow
• High shear strength after PCT (pressure cooker test)
  • Excellent resistance to moisture
  • Excellent workability for high volume production
• High accuracy with jet dispensing