NAMICS Liquid Compression Molding (LCM) material is an encapsulation material applied at the wafer level, offering high reliability and minimal warpage after curing.
Low warpage
- Suitable for reflow and grinding after PMC process.
Narrow Gap Flow
- Suitable for low profile packages.
High productivity
- NAMNICSÂ’ LCM allows higher productivity than current LCM thanks to its faster curing speed, resulting in increased UPH (Units Per Hour) at molding process.
